SCL Attends Fabtech

Posted: November 22, 2019 | Categories: Events

The recent FABTECH tradeshow and conference at McCormick Place in Chicago was a great success for Scientific Control Laboratories. Despite the bad weather that hit Chicago with record breaking snow totals, the event recorded a 7% increase over the previous event held in Chicago. Over 48,000 attendees from 95 countries participated in the four full days of product discovery, education and collaborative discussions on key industry issues.

One of the highlights of the show was the presentation of SCL’s A2LA and Nadcap accredited metallurgical testing services on coatings. “We discovered that few companies were aware of what types of testing we conduct for coatings and the level of detail we deliver in our reports. Many attendees were pleased to learn we deliver our test interpretations and observations efficiently and in clear, understandable reports,” stated Zak.

Each year, product failures and defects cost companies millions in lost revenue and impact their brand reputation. No stranger to the plating and coating industries, SCL provides metallurgical testing on products such as Failure Analysis, Adhesion, and Salt Fog (Salt Spray) Corrosion, in addition to additional chemical and product testing for companies nationwide.

“Yes, we’re certainly proud of our team and the advanced instrumentation and technical experience we have to offer,” stated SCL Vice President, Joelie Zak. “Yet our A2LA and Nadcap accreditations are what really help us stand apart from other companies. Our metallurgical lab is outstanding, and we pride ourselves in supplying the best for our clients.”

The SCL Team at Fabtech 2019

Fun at a trade show booth? Is that a thing? Anyone who has worked a tradeshow knows its long hours on your feet – especially when you’re presenting laboratory services. Yet during the recent FABTECH Expo, the SCL booth staff channeled their inner Charlies Angels and offered a smiling and enthusiastic method to showcasing solutions for product testing.